Case Study 1
Mobile SOC Chips

AP + Modem in Hisilicon

  • Process: TSMC N7​
  • Flip chip​
  • Size: 10.5mmX8mm. Totally about 84mm2​
  • IPs: CPU/GPU/NPU/ISP/MEDIA/MODEM/PERI/DDRs/USB/PCIE.​
  • over 5 power domains​
  • All the blocks are power off designs with power switch.​
  • 4+ voltage operating condition.​
  • 600+ signoff corners.​
  • CPU signoff at 2G Hz with A55 core .​

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Challenges:​

  • Multiple power domain​
  • Huge number of signoff corners​
  • High performance