Slide
Foundry & Node Selection
Wafer manufacturing Services
  1. Preferred Foundries: TSMC & Samsung
Packaging & Assembly Services
  1. Provides a complete solution from package selection through design and development, to high-volume manufacturing.
  2. Package Substrate Design,
  3. Thermal Modeling
  4. Signal Integrity Modeling
  5. In-system Modeling
System Board Services
  1. System boards design & development
  2. System Board Test Bench Set-up (soldered & socketed)
  3. Socket Design
Testing Services
  1. Test Platform Selection
  2. Test HW development
  3. Test Vector conversion
  4. Test Qualification Program generation
  5. ES Test program generation (sampling)
  6. Final Test program generation
  7. Qual Test program generation
Quality, Reliability Service
  1. Qualification Plan Generation
  2. ESD/LU HW development
  3. ESD/LU set-up and stress analysis per datasheet & fail point
  4. Package Qualification
  5. Die Qualification
  1. Burn-in HW Development
  2. Burn-in vectors conversion
  3. Burn-in Plan & execution to datasheet to fail point
  4. Reliability Report Generation
  5. Failure Analysis Plan & HW development
  6. Performing FA services (distractive & non-destructive)
Supply Chain Management
  1. Full start to ship supply chain management
  1. Sampling shipping plan
  2. Pre-production shipping plan
  3. Production shipping plan
  4. Full unit to lot/wafer traceability
  5. Real-time WIP tracking