WiFi6:​

• Process: TSMC 22ULL​
• Wire bound​
• Size: 3mmX3mm. Totally about 10mm2​
• Multiple power domains.​
• Full chip flatten implementation.​
• IP: RF/LDO/e-fuse/USB​

Challenges:​

• Make clear on power definition and connections.​
• Co-work with FE and PKG team.​
• Ultra low power requirement.​
• Minimize the clock cells numbers with special clock tree structure and mixed VT signoff.​
• PI enhancement and signoff​

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