Founder, President & CEO
Vice President of Business Operations
Vice President of Manufacturing Engineering
Director, Design Engineering
Director of Hardware Engineering,
General Manager for Taiwan
Legal Advisor of Corporate Affairs & Investments
General Counsel
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Farhat is the founder and CEO of GSME, where he brings over 25 years of hands-on experience in the semiconductor industry. Farhat is an expert in product, test, quality, reliability, and supply chain areas covering various hi-speed communication ICs, MEMS-based and CE System-based product lines. In 2016, Farhat led Quantenna to its IPO, which paved the way for the company’s acquisition by Onsemi for a staggering $1.1 billion in 2019. As the General Manager/Vice President of Manufacturing at Onsemi, he successfully managed the 300mm EFK Fab as well as a revenue line exceeding $2 billion. Farhat is a recognized industry leader and uses his extensive experience to drive innovation in the field of semiconductor manufacturing. He began his career after graduating with a Master of Science in Electrical Engineering from the University of Arkansas.
Dr. Atheer have excellent design and layout experience for chip and block level. On block level, he design, high speed DACs, mm-Wave ICs, PLLs, Oscillators, Clock buffers, Trans-impedance amplifiers, LDOs, LNAs, mixers, Wilkinson and resistive power splitters/combiners, 90 degrees hybrid couplers, Phase shifters, digital step attenuators DSAs, Band-gap references, Current sources and mirrors, Limiting amplifiers, LVDS drivers, Comparators, Op-amps, Base-band VGAs, Baseband Filters, frequency multipliers/doublers, MMDs and Fractional Synthesizers, SAR ADC, dc-dc converters, charge bumps, loop compensators. Solid knowledge of mm-wave power amplifiers (Bias, Classes, load-pull, EVM sims.). He also have experience in advanced node technologies, planar MOSFET (130nm, 55nm, 28nm) FinFets (16nm, 7nm) and SOI (60nm, 45nm, 22nm). Chip level experience: Planning placement and routing, Decoupling, IR Drop, reliability and electro-migration, ESD. He have good experience in simulating the package interface of the chip using HFSS and also simulating RF lineup specifications using SystemVue spectrasys.
Fred brings over 20 years of experience in the wireless industry, leading Customer Success teams at several semiconductor companies for Wi-Fi, Bluetooth, GPS, LTE modem, and AP/router. Previously, Fred managed global Customer Success teams in the US and ANZ as the Director of Customer Success at Morse Micro in Sydney. Prior to that, he was the FAE/AE director and Business Development Manager at Quantenna/Onsemi, where he successfully promoted products in Greater China, Korea, Japan, and SEA, securing key customers for high-performance WiFi6/6E APs. Fred even led the FAE team at Broadcom, winning the first WiFi5 11ac chip at world-class phone makers in Taiwan and China