The great explorer of the truth, the master-builder of human happiness no one rejects dislikes avoids pleasure itself because it is pleasure but because know who do not those how to pursue pleasures rationally encounter consequences that are extremely painful desires to obtain.
Read More TSMC 2H 2023 MPW Schedule
NOTE
- GDS for Trail Run = Tape Out Date – 2 weeks
- Final GDS = Tape Out Date – 1 week
- GDS for Trail Run = Tape Out Date – 2 weeks
- Final GDS = Tape Out Date – 1 week
Tech
(nm)
Process
Flavor
Block Size
Tape Out Date for 2H 2023
| 5 | CMOS LOGIC Fin FET | 1 mm2 | 9/20/2023 | |||||
| 7 | CMOS LOGIC Fin FET | 2 mm2 | 8/24/2023 | |||||
| 7 | CMOS LOGIC Fin FET Compact (Non-Shrink) | 2 mm2 | 8/24/2023 | |||||
| 12 | CMOS LOGIC Fin FET Compact (Shrink) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
| 12 | CMOS LOGIC Fin FET Compact Plus (Shrink) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
| 16 | CMOS LOGIC FinFET Compact (Shrink) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
| 16 | CMOS LOGIC FinFET Plus (16FF+) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
| 22 | CMOS Embedded Memory MRAM RF Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
| 22 | CMOS Embedded Memory MRAM Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
| 22 | CMOS Embedded Memory ReRAM RF Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
| 22 | CMOS LOGIC Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
| 22 | CMOS RF Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
| 22 | CMOS RF Ultra Low Power | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
| 28 | CMOS LOGIC HPC | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
| 28 | CMOS LOGIC HPC+ | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
| 28 | CMOS LOGIC Low Power | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
| 28 | CMOS RF HPC | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
| 28 | CMOS RF HPC+ | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
| 40 | CMOS HV, MX, LP LDMOS Triple Gate | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
| 40 | CMOS LOGIC LP | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
| 40 | CMOS LOGIC LP Non RPO2 | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
| 40 | CMOS MX/RF GP | 9 mm2 | 9/12/2023 | 11/7/2023 | ||||
| 40 | CMOS MX/RF, LP | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
| 40 | CMOS MX/RF, LP Non RPO2 | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
| 40 | CMOS MX/RF ULP | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
| 45 | CMOS LOGIC GP Superb (40G) | 9 mm2 | 9/12/2023 | 11/7/2023 | ||||
| 55 | CMOS Embedded Memory Flash RF LP | 12 mm2 | 10/18/2023 | |||||
| 65 | CMOS HV MX based LP LDMOS Triple Gate | 12 mm2 | 8/9/2023 | 10/4/2023 | 12/6/2023 | |||
| 65 | CMOS LOGIC GP Plus | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
| 65 | CMOS LOGIC ULP | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
| 65 | CMOS MX/RF GP Plus | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
| 65 | CMOS LOGIC LP | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
| 65 | CMOS MX/RF LP | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
| 90 | CMOS Embedded Memory Flash MS based LP | 16 mm2 | 12/20/2023 | |||||
| 90 | CMOS Embedded Memory Flash RF LP | 16 mm2 | 12/20/2023 | |||||
| 130 | CMOS HV MX based LP BCD Dual Gate | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS HV MXbased LP BCD Triple Gate | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS MX MS GP - 8 inch | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS MX MS LP - 8 inch | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS MX/RF GP - 8 inch | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS HV MXbased LP BCD Triple Gate | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS MX MS General Purpose | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS MX MS LP | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 130 | CMOS MX/RF GP | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
| 180 | CMOS HV MX based GP BCD Single Gate | 25 mm2 | ||||||
| 180 | CMOS HV MX based General Purpose BCD Dual Gate | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
| 180 | CMOS HV MX GP Gen-3 BCD Dual Gate | 25 mm2 | 9/13/2023 | 11/15/2023 | ||||
| 180 | CMOS Embedded Memory Flash MX based GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
| 180 | CMOS HV MX based LDMOS | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
| 180 | CMOS LOGIC GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
| 180 | CMOS MX MS GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
| 180 | CMOS MX/RF GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
| 250 | CMOS HV MX GP IIA based BCD Dual Gate | 25 mm2 | 7/19/2023 | |||||
| 250 | CMOS HV MX GP IIA based BCD Single Gate | 25 mm2 | 7/19/2023 | |||||
| 250 | CMOS HV MX GP IIA based BCD Triple Gate | 25 mm2 | 7/19/2023 | |||||
| 250 | CMOS MX MS GP | 25 mm2 | 7/19/2023 | 10/18/2023 | ||||
| 350 | CMOS MX MS GP | 25 mm2 | 8/9/2023 | 11/22/2023 |
CMOS LOGIC Fin FET
CMOS LOGIC Fin FET
CMOS LOGIC Fin FET Compact (Non-Shrink)
CMOS LOGIC Fin FET Compact (Shrink)
CMOS LOGIC Fin FET Compact Plus (Shrink)
CMOS LOGIC FinFET Compact (Shrink)
CMOS LOGIC FinFET Plus (16FF+)
CMOS Embedded Memory MRAM RF Ultra Low Leakage
CMOS Embedded Memory MRAM Ultra Low Leakage
CMOS Embedded Memory ReRAM RF Ultra Low Leakage
CMOS LOGIC Ultra Low Leakage
CMOS RF Ultra Low Leakage
CMOS RF Ultra Low Power
CMOS LOGIC HPC
CMOS LOGIC HPC+
CMOS LOGIC Low Power
CMOS RF HPC
CMOS RF HPC+
CMOS HV, MX, LP LDMOS Triple Gate
CMOS LOGIC LP
CMOS LOGIC LP Non RPO2
CMOS MX/RF GP
CMOS MX/RF, LP
CMOS MX/RF, LP Non RPO2
CMOS MX/RF ULP
CMOS LOGIC GP Superb (40G)
CMOS Embedded Memory Flash RF LP
CMOS HV MX based LP LDMOS Triple Gate
CMOS LOGIC GP Plus
CMOS LOGIC ULP
CMOS MX/RF GP Plus
CMOS LOGIC LP
CMOS MX/RF LP
CMOS Embedded Memory Flash MS based LP
CMOS Embedded Memory Flash RF LP
CMOS HV MX based LP BCD Dual Gate
CMOS HV MXbased LP BCD Triple Gate
CMOS MX MS GP - 8 inch
CMOS MX MS LP - 8 inch
CMOS MX/RF GP - 8 inch
CMOS HV MXbased LP BCD Triple Gate
CMOS MX MS General Purpose
CMOS MX MS LP
CMOS MX/RF GP
CMOS HV MX based GP BCD Single Gate
CMOS HV MX based General Purpose BCD Dual Gate
CMOS HV MX GP Gen-3 BCD Dual Gate
CMOS Embedded Memory Flash MX based GP
CMOS HV MX based LDMOS
CMOS LOGIC GP
CMOS MX MS GP
CMOS MX/RF GP
CMOS HV MX GP IIA based BCD Dual Gate
CMOS HV MX GP IIA based BCD Single Gate
CMOS HV MX GP IIA based BCD Triple Gate
CMOS MX MS GP
CMOS MX MS GP
CMOS LOGIC Fin FET
| Tech(nm) |
|---|
| 05 |
| Process Flavor |
| CMOS LOGIC Fin FET |
| Block Size |
| 1 mm2 |
| Tape Out Date for 2H 2023 |
| 9/20/2023 |
CMOS LOGIC Fin FET
| Tech(nm) |
|---|
| 07 |
| Process Flavor |
| CMOS LOGIC Fin FET |
| Block Size |
| 2 mm2 |
| Tape Out Date for 2H 2023 |
| 8/24/2023 |
CMOS LOGIC Fin FET Compact (Non-Shrink)
| Tech(nm) |
|---|
| 07 |
| Process Flavor |
| CMOS LOGIC Fin FET Compact (Non-Shrink) |
| Block Size |
| 2 mm2 |
| Tape Out Date for 2H 2023 |
| 8/24/2023 |
CMOS LOGIC Fin FET Compact (Shrink)
| Tech(nm) |
|---|
| 12 |
| Process Flavor |
| CMOS LOGIC Fin FET Compact (Shrink) |
| Block Size |
| 4 mm2 |
| Tape Out Date for 2H 2023 |
7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
CMOS LOGIC Fin FET Compact Plus (Shrink)
| Tech(nm) |
|---|
| 12 |
| Process Flavor |
| CMOS LOGIC Fin FET Compact Plus (Shrink) |
| Block Size |
| 4 mm2 |
| Tape Out Date for 2H 2023 |
| 7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
CMOS LOGIC FinFET Compact (Shrink)
| Tech(nm) |
|---|
| 16 |
| Process Flavor |
| CMOS LOGIC FinFET Compact (Shrink) |
| Block Size |
| 4 mm2 |
| Tape Out Date for 2H 2023 |
| 7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
CMOS LOGIC FinFET Plus (16FF+)
| Tech(nm) |
|---|
| 16 |
| Process Flavor |
| CMOS LOGIC FinFET Plus (16FF+) |
| Block Size |
| 4 mm2 |
| Tape Out Date for 2H 2023 |
| 7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
CMOS Embedded Memory MRAM RF Ultra Low Leakage
| Tech(nm) |
|---|
| 22 |
| Process Flavor |
| CMOS Embedded Memory MRAM RF Ultra Low Leakage |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
CMOS Embedded Memory MRAM Ultra Low Leakage
| Tech(nm) |
|---|
| 22 |
| Process Flavor |
| CMOS Embedded Memory MRAM Ultra Low Leakage |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
CMOS Embedded Memory ReRAM RF Ultra Low Leakage
| Tech(nm) |
|---|
| 22 |
| Process Flavor |
| CMOS Embedded Memory ReRAM RF Ultra Low Leakage |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
CMOS LOGIC Ultra Low Leakage
| Tech(nm) |
|---|
| 22 |
| Process Flavor |
| CMOS LOGIC Ultra Low Leakage |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
CMOS RF Ultra Low Leakage
| Tech(nm) |
|---|
| 22 |
| Process Flavor |
| CMOS RF Ultra Low Leakage |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
CMOS RF Ultra Low Power
| Tech(nm) |
|---|
| 22 |
| Process Flavor |
| CMOS RF Ultra Low Power |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/11/2023 9/6/2023 10/18/2023 11/8/2023 |
CMOS LOGIC HPC
| Tech(nm) |
|---|
| 28 |
| Process Flavor |
| CMOS LOGIC HPC |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
CMOS LOGIC HPC+
| Tech(nm) |
|---|
| 28 |
| Process Flavor |
| CMOS LOGIC HPC+ |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
CMOS LOGIC Low Power
| Tech(nm) |
|---|
| 28 |
| Process Flavor |
| CMOS LOGIC Low Power |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
CMOS RF HPC
| Tech(nm) |
|---|
| 28 |
| Process Flavor |
| CMOS RF HPC |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
CMOS RF HPC+
| Tech(nm) |
|---|
| 28 |
| Process Flavor |
| CMOS RF HPC+ |
| Block Size |
| 6 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
CMOS HV, MX, LP LDMOS Triple Gate
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS HV, MX, LP LDMOS Triple Gate |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
CMOS LOGIC LP
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS LOGIC LP |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
CMOS LOGIC LP Non RPO2
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS LOGIC LP Non RPO2 |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
CMOS MX/RF GP
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS MX/RF GP |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 9/12/2023 11/7/2023 |
CMOS MX/RF, LP
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS MX/RF, LP |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
CMOS MX/RF, LP Non RPO2
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS MX/RF, LP Non RPO2 |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
CMOS MX/RF ULP
| Tech(nm) |
|---|
| 40 |
| Process Flavor |
| CMOS MX/RF ULP |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
CMOS LOGIC GP Superb (40G)
| Tech(nm) |
|---|
| 45 |
| Process Flavor |
| CMOS LOGIC GP Superb (40G) |
| Block Size |
| 9 mm2 |
| Tape Out Date for 2H 2023 |
| 9/12/2023 11/7/2023 |
CMOS Embedded Memory Flash RF LP
| Tech(nm) |
|---|
| 55 |
| Process Flavor |
| CMOS Embedded Memory Flash RF LP |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 10/18/2023 |
CMOS HV MX based LP LDMOS Triple Gate
| Tech(nm) |
|---|
| 65 |
| Process Flavor |
| CMOS HV MX based LP LDMOS Triple Gate |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 8/9/2023 10/4/2023 12/6/2023 |
CMOS LOGIC GP Plus
| Tech(nm) |
|---|
| 65 |
| Process Flavor |
| CMOS LOGIC GP Plus |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
CMOS LOGIC ULP
| Tech(nm) |
|---|
| 65 |
| Process Flavor |
| CMOS LOGIC ULP |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
CMOS MX/RF GP Plus
| Tech(nm) |
|---|
| 65 |
| Process Flavor |
| CMOS MX/RF GP Plus |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
CMOS LOGIC LP
| Tech(nm) |
|---|
| 65 |
| Process Flavor |
| CMOS LOGIC LP |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
CMOS MX/RF LP
| Tech(nm) |
|---|
| 65 |
| Process Flavor |
| CMOS MX/RF LP |
| Block Size |
| 12 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
CMOS Embedded Memory Flash MS based LP
| Tech(nm) |
|---|
| 90 |
| Process Flavor |
| CMOS Embedded Memory Flash MS based LP |
| Block Size |
| 16 mm2 |
| Tape Out Date for 2H 2023 |
| 12/20/2023 |
CMOS Embedded Memory Flash RF LP
| Tech(nm) |
|---|
| 90 |
| Process Flavor |
| CMOS Embedded Memory Flash RF LP |
| Block Size |
| 16 mm2 |
| Tape Out Date for 2H 2023 |
| 12/20/2023 |
CMOS HV MX based LP BCD Dual Gate
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS HV MX based LP BCD Dual Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS HV MXbased LP BCD Triple Gate
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS HV MX based LP BCD Dual Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS MX MS GP - 8 inch
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS MX MS GP – 8 inch |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS MX MS LP - 8 inch
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS MX MS LP – 8 inch |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS MX/RF GP - 8 inch
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS MX/RF GP – 8 inch |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS HV MXbased LP BCD Triple Gate
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS HV MXbased LP BCD Triple Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS MX MS General Purpose
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS MX MS General Purpose |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS MX MS LP
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS MX MS LP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS MX/RF GP
| Tech(nm) |
|---|
| 130 |
| Process Flavor |
| CMOS MX/RF GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/2/2023 11/22/2023 |
CMOS HV MX based GP BCD Single Gate
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS HV MX based GP BCD Single Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
CMOS HV MX based General Purpose BCD Dual Gate
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS HV MX based General Purpose BCD Dual Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
CMOS HV MX GP Gen-3 BCD Dual Gate
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS HV MX GP Gen-3 BCD Dual Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 9/13/2023 11/15/2023 |
CMOS Embedded Memory Flash MX based GP
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS Embedded Memory Flash MX based GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
CMOS HV MX based LDMOS
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS HV MX based LDMOS |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
CMOS LOGIC GP
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS LOGIC GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
CMOS MX MS GP
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS MX MS GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
CMOS MX/RF GP
| Tech(nm) |
|---|
| 180 |
| Process Flavor |
| CMOS MX/RF GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
CMOS HV MX GP IIA based BCD Dual Gate
| Tech(nm) |
|---|
| 250 |
| Process Flavor |
| CMOS HV MX GP IIA based BCD Dual Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 |
CMOS HV MX GP IIA based BCD Single Gate
| Tech(nm) |
|---|
| 250 |
| Process Flavor |
| CMOS HV MX GP IIA based BCD Single Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 |
CMOS HV MX GP IIA based BCD Triple Gate
| Tech(nm) |
|---|
| 250 |
| Process Flavor |
| CMOS HV MX GP IIA based BCD Triple Gate |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 |
CMOS MX MS GP
| Tech(nm) |
|---|
| 250 |
| Process Flavor |
| CMOS MX MS GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 7/19/2023 10/18/2023 |
CMOS MX MS GP
| Tech(nm) |
|---|
| 350 |
| Process Flavor |
| CMOS MX MS GP |
| Block Size |
| 25 mm2 |
| Tape Out Date for 2H 2023 |
| 8/9/2023 11/22/2023 |
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