TSMC 2H 2023 MPW Schedule

NOTE

Tech (nm)Process FlavorBlock SizeTape Out Date for 2H 2023
5nmCMOS LOGIC Fin FET1 mm29/20/2023
7nmCMOS LOGIC Fin FET2 mm28/24/2023
7nmCMOS LOGIC Fin FET Compact (Non-Shrink)2 mm28/24/2023
12nmCMOS LOGIC Fin FET Compact (Shrink)4 mm27/11/20238/8/202310/3/202312/12/2023
12nmCMOS LOGIC Fin FET Compact Plus (Shrink)4 mm27/11/20238/8/202310/3/202312/12/2023
16nmCMOS LOGIC FinFET Compact (Shrink)4 mm27/11/20238/8/202310/3/202312/12/2023
16nmCMOS LOGIC FinFET Plus (16FF+)4 mm27/11/20238/8/202310/3/202312/12/2023
22nmCMOS Embedded Memory MRAM RF Ultra Low Leakage6 mm27/12/20239/6/202310/18/202311/8/2023
22nmCMOS Embedded Memory MRAM Ultra Low Leakage6 mm27/12/20239/6/202310/18/202311/8/2023
22nmCMOS Embedded Memory ReRAM RF Ultra Low Leakage6 mm27/12/20239/6/202310/18/202311/8/2023
22nmCMOS LOGIC Ultra Low Leakage6 mm27/12/20239/6/202310/18/202311/8/2023
22nmCMOS RF Ultra Low Leakage6 mm27/12/20239/6/202310/18/202311/8/2023
22nmCMOS RF Ultra Low Power6 mm27/12/20239/6/202310/18/202311/8/2023
28nmCMOS LOGIC HPC6 mm27/19/20238/16/20239/20/202311/15/202312/13/2023
28nmCMOS LOGIC HPC+6 mm27/19/20238/16/20239/20/202311/15/202312/13/2023
28nmCMOS LOGIC Low Power6 mm27/19/20238/16/20239/20/202311/15/202312/13/2023
28nmCMOS RF HPC6 mm27/19/20238/16/20239/20/202311/15/202312/13/2023
28nmCMOS RF HPC+6 mm27/19/20238/16/20239/20/202311/15/202312/13/2023
40nmCMOS HV, MX, LP LDMOS Triple Gate9 mm28/8/20239/12/202310/17/202311/7/202312/5/2023
40nmCMOS LOGIC LP9 mm28/8/20239/12/202310/17/202311/7/202312/5/2023
40nmCMOS LOGIC LP Non RPO29 mm28/8/20239/12/202310/17/202311/7/202312/5/2023
40nmCMOS MX/RF GP9 mm29/12/202311/7/2023
40nmCMOS MX/RF, LP9 mm28/8/20239/12/202310/17/202311/7/202312/5/2023
40nmCMOS MX/RF, LP Non RPO29 mm28/8/20239/12/202310/17/202311/7/202312/5/2023
40nmCMOS MX/RF ULP9 mm28/8/20239/12/202310/17/202311/7/202312/5/2023
45nmCMOS LOGIC GP Superb (40G) 9 mm29/12/2023 11/7/2023
55nmCMOS Embedded Memory Flash RF LP12 mm210/18/2023
65nmCMOS HV MX based LP LDMOS Triple Gate 12 mm2 8/9/2023 10/4/2023 12/6/2023
65nmCMOS LOGIC GP Plus12 mm27/5/20238/9/20239/13/202310/4/202311/8/202312/6/2023
65nmCMOS LOGIC ULP12 mm27/5/20238/9/20239/13/202310/4/202311/8/202312/6/2023
65nmCMOS MX/RF GP Plus12 mm27/5/20238/9/20239/13/202310/4/202311/8/202312/6/2023
65nmCMOS LOGIC LP12 mm27/5/20238/9/20239/13/202310/4/202311/8/202312/6/2023
65nmCMOS MX/RF LP12 mm27/5/20238/9/20239/13/202310/4/202311/8/202312/6/2023
90nmCMOS Embedded Memory Flash MS based LP16 mm212/20/2023
90nmCMOS Embedded Memory Flash RF LP16 mm212/20/2023
130nmCMOS HV MX based LP BCD Dual Gate 25 mm28/2/202311/22/2023
130nmCMOS HV MXbased LP BCD Triple Gate25 mm28/2/202311/22/2023
130nmCMOS MX MS GP - 8 inch25 mm28/2/202311/22/2023
130nmCMOS MX MS LP - 8 inch25 mm28/2/202311/22/2023
130nmCMOS MX/RF GP - 8 inch25 mm28/2/202311/22/2023
130nmCMOS HV MXbased LP BCD Triple Gate25 mm28/2/202311/22/2023
130nm CMOS MX MS General Purpose 25 mm28/2/202311/22/2023
130nmCMOS MX MS LP25 mm28/2/202311/22/2023
130nmCMOS MX/RF GP25 mm28/2/202311/22/2023
180nmCMOS HV MX based GP BCD Single Gate 25 mm2
180nmCMOS HV MX based General Purpose BCD Dual Gate 25 mm27/5/20238/16/20239/13/202310/18/202311/22/202312/13/2023
180nmCMOS HV MX GP Gen-3 BCD Dual Gate25 mm29/13/202311/15/2023
180nmCMOS Embedded Memory Flash MX based GP25 mm27/5/20238/16/20239/13/202310/18/202311/22/202312/13/2023
180nmCMOS HV MX based LDMOS25 mm27/5/20238/16/20239/13/202310/18/202311/22/202312/13/2023
180nmCMOS LOGIC GP25 mm27/5/20238/16/20239/13/202310/18/202311/22/202312/13/2023
180nmCMOS MX MS GP25 mm27/5/20238/16/20239/13/202310/18/202311/22/202312/13/2023
180nmCMOS MX/RF GP25 mm27/5/20238/16/20239/13/202310/18/202311/22/202312/13/2023
250nmCMOS HV MX GP IIA based BCD Dual Gate25 mm27/19/2023
250nmCMOS HV MX GP IIA based BCD Single Gate25 mm27/19/2023
250nmCMOS HV MX GP IIA based BCD Triple Gate25 mm27/19/2023
250nmCMOS MX MS GP25 mm27/19/202310/18/2023
350nmCMOS MX MS GP25 mm28/9/202311/22/2023