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5 | CMOS LOGIC Fin FET | 1 mm2 | 9/20/2023 | |||||
7 | CMOS LOGIC Fin FET | 2 mm2 | 8/24/2023 | |||||
7 | CMOS LOGIC Fin FET Compact (Non-Shrink) | 2 mm2 | 8/24/2023 | |||||
12 | CMOS LOGIC Fin FET Compact (Shrink) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
12 | CMOS LOGIC Fin FET Compact Plus (Shrink) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
16 | CMOS LOGIC FinFET Compact (Shrink) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
16 | CMOS LOGIC FinFET Plus (16FF+) | 4 mm2 | 7/11/2023 | 8/8/2023 | 10/3/2023 | 12/12/2023 | ||
22 | CMOS Embedded Memory MRAM RF Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
22 | CMOS Embedded Memory MRAM Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
22 | CMOS Embedded Memory ReRAM RF Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
22 | CMOS LOGIC Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
22 | CMOS RF Ultra Low Leakage | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
22 | CMOS RF Ultra Low Power | 6 mm2 | 7/12/2023 | 9/6/2023 | 10/18/2023 | 11/8/2023 | ||
28 | CMOS LOGIC HPC | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
28 | CMOS LOGIC HPC+ | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
28 | CMOS LOGIC Low Power | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
28 | CMOS RF HPC | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
28 | CMOS RF HPC+ | 6 mm2 | 7/19/2023 | 8/16/2023 | 9/20/2023 | 11/15/2023 | 12/13/2023 | |
40 | CMOS HV, MX, LP LDMOS Triple Gate | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
40 | CMOS LOGIC LP | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
40 | CMOS LOGIC LP Non RPO2 | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
40 | CMOS MX/RF GP | 9 mm2 | 9/12/2023 | 11/7/2023 | ||||
40 | CMOS MX/RF, LP | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
40 | CMOS MX/RF, LP Non RPO2 | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
40 | CMOS MX/RF ULP | 9 mm2 | 8/8/2023 | 9/12/2023 | 10/17/2023 | 11/7/2023 | 12/5/2023 | |
45 | CMOS LOGIC GP Superb (40G) | 9 mm2 | 9/12/2023 | 11/7/2023 | ||||
55 | CMOS Embedded Memory Flash RF LP | 12 mm2 | 10/18/2023 | |||||
65 | CMOS HV MX based LP LDMOS Triple Gate | 12 mm2 | 8/9/2023 | 10/4/2023 | 12/6/2023 | |||
65 | CMOS LOGIC GP Plus | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
65 | CMOS LOGIC ULP | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
65 | CMOS MX/RF GP Plus | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
65 | CMOS LOGIC LP | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
65 | CMOS MX/RF LP | 12 mm2 | 7/5/2023 | 8/9/2023 | 9/13/2023 | 10/4/2023 | 11/8/2023 | 12/6/2023 |
90 | CMOS Embedded Memory Flash MS based LP | 16 mm2 | 12/20/2023 | |||||
90 | CMOS Embedded Memory Flash RF LP | 16 mm2 | 12/20/2023 | |||||
130 | CMOS HV MX based LP BCD Dual Gate | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS HV MXbased LP BCD Triple Gate | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS MX MS GP - 8 inch | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS MX MS LP - 8 inch | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS MX/RF GP - 8 inch | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS HV MXbased LP BCD Triple Gate | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS MX MS General Purpose | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS MX MS LP | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
130 | CMOS MX/RF GP | 25 mm2 | 8/2/2023 | 11/22/2023 | ||||
180 | CMOS HV MX based GP BCD Single Gate | 25 mm2 | ||||||
180 | CMOS HV MX based General Purpose BCD Dual Gate | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
180 | CMOS HV MX GP Gen-3 BCD Dual Gate | 25 mm2 | 9/13/2023 | 11/15/2023 | ||||
180 | CMOS Embedded Memory Flash MX based GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
180 | CMOS HV MX based LDMOS | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
180 | CMOS LOGIC GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
180 | CMOS MX MS GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
180 | CMOS MX/RF GP | 25 mm2 | 7/5/2023 | 8/16/2023 | 9/13/2023 | 10/18/2023 | 11/22/2023 | 12/13/2023 |
250 | CMOS HV MX GP IIA based BCD Dual Gate | 25 mm2 | 7/19/2023 | |||||
250 | CMOS HV MX GP IIA based BCD Single Gate | 25 mm2 | 7/19/2023 | |||||
250 | CMOS HV MX GP IIA based BCD Triple Gate | 25 mm2 | 7/19/2023 | |||||
250 | CMOS MX MS GP | 25 mm2 | 7/19/2023 | 10/18/2023 | ||||
350 | CMOS MX MS GP | 25 mm2 | 8/9/2023 | 11/22/2023 |
Tech(nm) |
---|
05 |
Process Flavor |
CMOS LOGIC Fin FET |
Block Size |
1 mm2 |
Tape Out Date for 2H 2023 |
9/20/2023 |
Tech(nm) |
---|
07 |
Process Flavor |
CMOS LOGIC Fin FET |
Block Size |
2 mm2 |
Tape Out Date for 2H 2023 |
8/24/2023 |
Tech(nm) |
---|
07 |
Process Flavor |
CMOS LOGIC Fin FET Compact (Non-Shrink) |
Block Size |
2 mm2 |
Tape Out Date for 2H 2023 |
8/24/2023 |
Tech(nm) |
---|
12 |
Process Flavor |
CMOS LOGIC Fin FET Compact (Shrink) |
Block Size |
4 mm2 |
Tape Out Date for 2H 2023 |
7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
Tech(nm) |
---|
12 |
Process Flavor |
CMOS LOGIC Fin FET Compact Plus (Shrink) |
Block Size |
4 mm2 |
Tape Out Date for 2H 2023 |
7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
Tech(nm) |
---|
16 |
Process Flavor |
CMOS LOGIC FinFET Compact (Shrink) |
Block Size |
4 mm2 |
Tape Out Date for 2H 2023 |
7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
Tech(nm) |
---|
16 |
Process Flavor |
CMOS LOGIC FinFET Plus (16FF+) |
Block Size |
4 mm2 |
Tape Out Date for 2H 2023 |
7/11/2023 8/8/2023 10/3/2023 12/12/2023 |
Tech(nm) |
---|
22 |
Process Flavor |
CMOS Embedded Memory MRAM RF Ultra Low Leakage |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
Tech(nm) |
---|
22 |
Process Flavor |
CMOS Embedded Memory MRAM Ultra Low Leakage |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
Tech(nm) |
---|
22 |
Process Flavor |
CMOS Embedded Memory ReRAM RF Ultra Low Leakage |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
Tech(nm) |
---|
22 |
Process Flavor |
CMOS LOGIC Ultra Low Leakage |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
Tech(nm) |
---|
22 |
Process Flavor |
CMOS RF Ultra Low Leakage |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/12/2023 9/6/2023 10/18/2023 11/8/2023 |
Tech(nm) |
---|
22 |
Process Flavor |
CMOS RF Ultra Low Power |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/11/2023 9/6/2023 10/18/2023 11/8/2023 |
Tech(nm) |
---|
28 |
Process Flavor |
CMOS LOGIC HPC |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
Tech(nm) |
---|
28 |
Process Flavor |
CMOS LOGIC HPC+ |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
Tech(nm) |
---|
28 |
Process Flavor |
CMOS LOGIC Low Power |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
Tech(nm) |
---|
28 |
Process Flavor |
CMOS RF HPC |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
Tech(nm) |
---|
28 |
Process Flavor |
CMOS RF HPC+ |
Block Size |
6 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS HV, MX, LP LDMOS Triple Gate |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS LOGIC LP |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS LOGIC LP Non RPO2 |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS MX/RF GP |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
9/12/2023 11/7/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS MX/RF, LP |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS MX/RF, LP Non RPO2 |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
Tech(nm) |
---|
40 |
Process Flavor |
CMOS MX/RF ULP |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023 |
Tech(nm) |
---|
45 |
Process Flavor |
CMOS LOGIC GP Superb (40G) |
Block Size |
9 mm2 |
Tape Out Date for 2H 2023 |
9/12/2023 11/7/2023 |
Tech(nm) |
---|
55 |
Process Flavor |
CMOS Embedded Memory Flash RF LP |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
10/18/2023 |
Tech(nm) |
---|
65 |
Process Flavor |
CMOS HV MX based LP LDMOS Triple Gate |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
8/9/2023 10/4/2023 12/6/2023 |
Tech(nm) |
---|
65 |
Process Flavor |
CMOS LOGIC GP Plus |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
Tech(nm) |
---|
65 |
Process Flavor |
CMOS LOGIC ULP |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
Tech(nm) |
---|
65 |
Process Flavor |
CMOS MX/RF GP Plus |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
Tech(nm) |
---|
65 |
Process Flavor |
CMOS LOGIC LP |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
Tech(nm) |
---|
65 |
Process Flavor |
CMOS MX/RF LP |
Block Size |
12 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023 |
Tech(nm) |
---|
90 |
Process Flavor |
CMOS Embedded Memory Flash MS based LP |
Block Size |
16 mm2 |
Tape Out Date for 2H 2023 |
12/20/2023 |
Tech(nm) |
---|
90 |
Process Flavor |
CMOS Embedded Memory Flash RF LP |
Block Size |
16 mm2 |
Tape Out Date for 2H 2023 |
12/20/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS HV MX based LP BCD Dual Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS HV MX based LP BCD Dual Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS MX MS GP – 8 inch |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS MX MS LP – 8 inch |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS MX/RF GP – 8 inch |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS HV MXbased LP BCD Triple Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS MX MS General Purpose |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS MX MS LP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
130 |
Process Flavor |
CMOS MX/RF GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/2/2023 11/22/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS HV MX based GP BCD Single Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS HV MX based General Purpose BCD Dual Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS HV MX GP Gen-3 BCD Dual Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
9/13/2023 11/15/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS Embedded Memory Flash MX based GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS HV MX based LDMOS |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS LOGIC GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS MX MS GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
Tech(nm) |
---|
180 |
Process Flavor |
CMOS MX/RF GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023 |
Tech(nm) |
---|
250 |
Process Flavor |
CMOS HV MX GP IIA based BCD Dual Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 |
Tech(nm) |
---|
250 |
Process Flavor |
CMOS HV MX GP IIA based BCD Single Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 |
Tech(nm) |
---|
250 |
Process Flavor |
CMOS HV MX GP IIA based BCD Triple Gate |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 |
Tech(nm) |
---|
250 |
Process Flavor |
CMOS MX MS GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
7/19/2023 10/18/2023 |
Tech(nm) |
---|
350 |
Process Flavor |
CMOS MX MS GP |
Block Size |
25 mm2 |
Tape Out Date for 2H 2023 |
8/9/2023 11/22/2023 |
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