Tapeout Schedule

TSMC 2H 2023 MPW Schedule

NOTE

Tech
(nm)

Process
Flavor

Block Size

Tape Out Date for 2H 2023


5	CMOS LOGIC Fin FET	1 mm2			9/20/2023
7	CMOS LOGIC Fin FET	2 mm2		8/24/2023
7	CMOS LOGIC Fin FET Compact (Non-Shrink)	2 mm2		8/24/2023
12	CMOS LOGIC Fin FET Compact (Shrink)	4 mm2	7/11/2023	8/8/2023		10/3/2023		12/12/2023
12	CMOS LOGIC Fin FET Compact Plus (Shrink)	4 mm2	7/11/2023	8/8/2023		10/3/2023		12/12/2023
16	CMOS LOGIC FinFET Compact (Shrink)	4 mm2	7/11/2023	8/8/2023		10/3/2023		12/12/2023
16	CMOS LOGIC FinFET Plus (16FF+)	4 mm2	7/11/2023	8/8/2023		10/3/2023		12/12/2023
22	CMOS Embedded Memory MRAM RF Ultra Low Leakage	6 mm2	7/12/2023		9/6/2023	10/18/2023	11/8/2023
22	CMOS Embedded Memory MRAM Ultra Low Leakage	6 mm2	7/12/2023		9/6/2023	10/18/2023	11/8/2023
22	CMOS Embedded Memory ReRAM RF Ultra Low Leakage	6 mm2	7/12/2023		9/6/2023	10/18/2023	11/8/2023
22	CMOS LOGIC Ultra Low Leakage	6 mm2	7/12/2023		9/6/2023	10/18/2023	11/8/2023
22	CMOS RF Ultra Low Leakage	6 mm2	7/12/2023		9/6/2023	10/18/2023	11/8/2023
22	CMOS RF Ultra Low Power	6 mm2	7/12/2023		9/6/2023	10/18/2023	11/8/2023
28	CMOS LOGIC HPC	6 mm2	7/19/2023	8/16/2023	9/20/2023		11/15/2023	12/13/2023
28	CMOS LOGIC HPC+	6 mm2	7/19/2023	8/16/2023	9/20/2023		11/15/2023	12/13/2023
28	CMOS LOGIC Low Power	6 mm2	7/19/2023	8/16/2023	9/20/2023		11/15/2023	12/13/2023
28	CMOS RF HPC	6 mm2	7/19/2023	8/16/2023	9/20/2023		11/15/2023	12/13/2023
28	CMOS RF HPC+	6 mm2	7/19/2023	8/16/2023	9/20/2023		11/15/2023	12/13/2023
40	CMOS HV, MX, LP LDMOS Triple Gate	9 mm2		8/8/2023	9/12/2023	10/17/2023	11/7/2023	12/5/2023
40	CMOS LOGIC LP	9 mm2		8/8/2023	9/12/2023	10/17/2023	11/7/2023	12/5/2023
40	CMOS LOGIC LP Non RPO2	9 mm2		8/8/2023	9/12/2023	10/17/2023	11/7/2023	12/5/2023
40	CMOS MX/RF GP	9 mm2			9/12/2023		11/7/2023
40	CMOS MX/RF, LP	9 mm2		8/8/2023	9/12/2023	10/17/2023	11/7/2023	12/5/2023
40	CMOS MX/RF, LP Non RPO2	9 mm2		8/8/2023	9/12/2023	10/17/2023	11/7/2023	12/5/2023
40	CMOS MX/RF ULP	9 mm2		8/8/2023	9/12/2023	10/17/2023	11/7/2023	12/5/2023
45	CMOS LOGIC GP Superb (40G)	9 mm2			9/12/2023		11/7/2023
55	CMOS Embedded Memory Flash RF LP	12 mm2				10/18/2023
65	CMOS HV MX based LP LDMOS Triple Gate	12 mm2		8/9/2023		10/4/2023		12/6/2023
65	CMOS LOGIC GP Plus	12 mm2	7/5/2023	8/9/2023	9/13/2023	10/4/2023	11/8/2023	12/6/2023
65	CMOS LOGIC ULP	12 mm2	7/5/2023	8/9/2023	9/13/2023	10/4/2023	11/8/2023	12/6/2023
65	CMOS MX/RF GP Plus	12 mm2	7/5/2023	8/9/2023	9/13/2023	10/4/2023	11/8/2023	12/6/2023
65	CMOS LOGIC LP	12 mm2	7/5/2023	8/9/2023	9/13/2023	10/4/2023	11/8/2023	12/6/2023
65	CMOS MX/RF LP	12 mm2	7/5/2023	8/9/2023	9/13/2023	10/4/2023	11/8/2023	12/6/2023
90	CMOS Embedded Memory Flash MS based LP	16 mm2						12/20/2023
90	CMOS Embedded Memory Flash RF LP	16 mm2						12/20/2023
130	CMOS HV MX based LP BCD Dual Gate	25 mm2		8/2/2023			11/22/2023
130	CMOS HV MXbased LP BCD Triple Gate	25 mm2		8/2/2023			11/22/2023
130	CMOS MX MS GP - 8 inch	25 mm2		8/2/2023			11/22/2023
130	CMOS MX MS LP - 8 inch	25 mm2		8/2/2023			11/22/2023
130	CMOS MX/RF GP - 8 inch	25 mm2		8/2/2023			11/22/2023
130	CMOS HV MXbased LP BCD Triple Gate	25 mm2		8/2/2023			11/22/2023
130	CMOS MX MS General Purpose	25 mm2		8/2/2023			11/22/2023
130	CMOS MX MS LP	25 mm2		8/2/2023			11/22/2023
130	CMOS MX/RF GP	25 mm2		8/2/2023			11/22/2023
180	CMOS HV MX based GP BCD Single Gate	25 mm2
180	CMOS HV MX based General Purpose BCD Dual Gate	25 mm2	7/5/2023	8/16/2023	9/13/2023	10/18/2023	11/22/2023	12/13/2023
180	CMOS HV MX GP Gen-3 BCD Dual Gate	25 mm2			9/13/2023		11/15/2023
180	CMOS Embedded Memory Flash MX based GP	25 mm2	7/5/2023	8/16/2023	9/13/2023	10/18/2023	11/22/2023	12/13/2023
180	CMOS HV MX based LDMOS	25 mm2	7/5/2023	8/16/2023	9/13/2023	10/18/2023	11/22/2023	12/13/2023
180	CMOS LOGIC GP	25 mm2	7/5/2023	8/16/2023	9/13/2023	10/18/2023	11/22/2023	12/13/2023
180	CMOS MX MS GP	25 mm2	7/5/2023	8/16/2023	9/13/2023	10/18/2023	11/22/2023	12/13/2023
180	CMOS MX/RF GP	25 mm2	7/5/2023	8/16/2023	9/13/2023	10/18/2023	11/22/2023	12/13/2023
250	CMOS HV MX GP IIA based BCD Dual Gate	25 mm2	7/19/2023
250	CMOS HV MX GP IIA based BCD Single Gate	25 mm2	7/19/2023
250	CMOS HV MX GP IIA based BCD Triple Gate	25 mm2	7/19/2023
250	CMOS MX MS GP	25 mm2	7/19/2023			10/18/2023
350	CMOS MX MS GP	25 mm2		8/9/2023			11/22/2023

CMOS LOGIC Fin FET

CMOS LOGIC Fin FET Compact (Non-Shrink)

CMOS LOGIC Fin FET Compact (Shrink)

CMOS LOGIC Fin FET Compact Plus (Shrink)

CMOS LOGIC FinFET Compact (Shrink)

CMOS LOGIC FinFET Plus (16FF+)

CMOS Embedded Memory MRAM RF Ultra Low Leakage

CMOS Embedded Memory MRAM Ultra Low Leakage

CMOS Embedded Memory ReRAM RF Ultra Low Leakage

CMOS LOGIC Ultra Low Leakage

CMOS RF Ultra Low Leakage

CMOS RF Ultra Low Power

CMOS LOGIC HPC

CMOS LOGIC HPC+

CMOS LOGIC Low Power

CMOS RF HPC

CMOS RF HPC+

CMOS HV, MX, LP LDMOS Triple Gate

CMOS LOGIC LP

CMOS LOGIC LP Non RPO2

CMOS MX/RF GP

CMOS MX/RF, LP

CMOS MX/RF, LP Non RPO2

CMOS MX/RF ULP

CMOS LOGIC GP Superb (40G)

CMOS Embedded Memory Flash RF LP

CMOS HV MX based LP LDMOS Triple Gate

CMOS LOGIC GP Plus

CMOS LOGIC ULP

CMOS MX/RF GP Plus

CMOS LOGIC LP

CMOS MX/RF LP

CMOS Embedded Memory Flash MS based LP

CMOS Embedded Memory Flash RF LP

CMOS HV MX based LP BCD Dual Gate

CMOS HV MXbased LP BCD Triple Gate

CMOS MX MS GP - 8 inch

CMOS MX MS LP - 8 inch

CMOS MX/RF GP - 8 inch

CMOS HV MXbased LP BCD Triple Gate

CMOS MX MS General Purpose

CMOS MX MS LP

CMOS MX/RF GP

CMOS HV MX based GP BCD Single Gate

CMOS HV MX based General Purpose BCD Dual Gate

CMOS HV MX GP Gen-3 BCD Dual Gate

CMOS Embedded Memory Flash MX based GP

CMOS HV MX based LDMOS

CMOS LOGIC GP

CMOS MX MS GP

CMOS MX/RF GP

CMOS HV MX GP IIA based BCD Dual Gate

CMOS HV MX GP IIA based BCD Single Gate

CMOS HV MX GP IIA based BCD Triple Gate

CMOS MX MS GP

CMOS LOGIC Fin FET

Tech(nm)
05
Process Flavor
CMOS LOGIC Fin FET
Block Size
1 mm2
Tape Out Date for 2H 2023
9/20/2023

Tech(nm)
07
Process Flavor
CMOS LOGIC Fin FET
Block Size
2 mm2
Tape Out Date for 2H 2023
8/24/2023

CMOS LOGIC Fin FET Compact (Non-Shrink)

Tech(nm)
07
Process Flavor
CMOS LOGIC Fin FET Compact (Non-Shrink)
Block Size
2 mm2
Tape Out Date for 2H 2023
8/24/2023

CMOS LOGIC Fin FET Compact (Shrink)

Tech(nm)
12
Process Flavor
CMOS LOGIC Fin FET Compact (Shrink)
Block Size
4 mm2
Tape Out Date for 2H 2023
7/11/2023 8/8/2023 10/3/2023 12/12/2023

CMOS LOGIC Fin FET Compact Plus (Shrink)

Tech(nm)
12
Process Flavor
CMOS LOGIC Fin FET Compact Plus (Shrink)
Block Size
4 mm2
Tape Out Date for 2H 2023
7/11/2023 8/8/2023 10/3/2023 12/12/2023

CMOS LOGIC FinFET Compact (Shrink)

Tech(nm)
16
Process Flavor
CMOS LOGIC FinFET Compact (Shrink)
Block Size
4 mm2
Tape Out Date for 2H 2023
7/11/2023 8/8/2023 10/3/2023 12/12/2023

CMOS LOGIC FinFET Plus (16FF+)

Tech(nm)
16
Process Flavor
CMOS LOGIC FinFET Plus (16FF+)
Block Size
4 mm2
Tape Out Date for 2H 2023
7/11/2023 8/8/2023 10/3/2023 12/12/2023

CMOS Embedded Memory MRAM RF Ultra Low Leakage

Tech(nm)
22
Process Flavor
CMOS Embedded Memory MRAM RF Ultra Low Leakage
Block Size
6 mm2
Tape Out Date for 2H 2023
7/12/2023 9/6/2023 10/18/2023 11/8/2023

CMOS Embedded Memory MRAM Ultra Low Leakage

Tech(nm)
22
Process Flavor
CMOS Embedded Memory MRAM Ultra Low Leakage
Block Size
6 mm2
Tape Out Date for 2H 2023
7/12/2023 9/6/2023 10/18/2023 11/8/2023

CMOS Embedded Memory ReRAM RF Ultra Low Leakage

Tech(nm)
22
Process Flavor
CMOS Embedded Memory ReRAM RF Ultra Low Leakage
Block Size
6 mm2
Tape Out Date for 2H 2023
7/12/2023 9/6/2023 10/18/2023 11/8/2023

CMOS LOGIC Ultra Low Leakage

Tech(nm)
22
Process Flavor
CMOS LOGIC Ultra Low Leakage
Block Size
6 mm2
Tape Out Date for 2H 2023
7/12/2023 9/6/2023 10/18/2023 11/8/2023

CMOS RF Ultra Low Leakage

Tech(nm)
22
Process Flavor
CMOS RF Ultra Low Leakage
Block Size
6 mm2
Tape Out Date for 2H 2023
7/12/2023 9/6/2023 10/18/2023 11/8/2023

CMOS RF Ultra Low Power

Tech(nm)
22
Process Flavor
CMOS RF Ultra Low Power
Block Size
6 mm2
Tape Out Date for 2H 2023
7/11/2023 9/6/2023 10/18/2023 11/8/2023

CMOS LOGIC HPC

Tech(nm)
28
Process Flavor
CMOS LOGIC HPC
Block Size
6 mm2
Tape Out Date for 2H 2023
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023

CMOS LOGIC HPC+

Tech(nm)
28
Process Flavor
CMOS LOGIC HPC+
Block Size
6 mm2
Tape Out Date for 2H 2023
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023

CMOS LOGIC Low Power

Tech(nm)
28
Process Flavor
CMOS LOGIC Low Power
Block Size
6 mm2
Tape Out Date for 2H 2023
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023

CMOS RF HPC

Tech(nm)
28
Process Flavor
CMOS RF HPC
Block Size
6 mm2
Tape Out Date for 2H 2023
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023

CMOS RF HPC+

Tech(nm)
28
Process Flavor
CMOS RF HPC+
Block Size
6 mm2
Tape Out Date for 2H 2023
7/19/2023 8/16/2023 9/20/2023 11/15/2023 12/13/2023

CMOS HV, MX, LP LDMOS Triple Gate

Tech(nm)
40
Process Flavor
CMOS HV, MX, LP LDMOS Triple Gate
Block Size
9 mm2
Tape Out Date for 2H 2023
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023

CMOS LOGIC LP

Tech(nm)
40
Process Flavor
CMOS LOGIC LP
Block Size
9 mm2
Tape Out Date for 2H 2023
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023

CMOS LOGIC LP Non RPO2

Tech(nm)
40
Process Flavor
CMOS LOGIC LP Non RPO2
Block Size
9 mm2
Tape Out Date for 2H 2023
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023

CMOS MX/RF GP

Tech(nm)
40
Process Flavor
CMOS MX/RF GP
Block Size
9 mm2
Tape Out Date for 2H 2023
9/12/2023 11/7/2023

CMOS MX/RF, LP

Tech(nm)
40
Process Flavor
CMOS MX/RF, LP
Block Size
9 mm2
Tape Out Date for 2H 2023
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023

CMOS MX/RF, LP Non RPO2

Tech(nm)
40
Process Flavor
CMOS MX/RF, LP Non RPO2
Block Size
9 mm2
Tape Out Date for 2H 2023
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023

CMOS MX/RF ULP

Tech(nm)
40
Process Flavor
CMOS MX/RF ULP
Block Size
9 mm2
Tape Out Date for 2H 2023
8/8/2023 9/12/2023 10/17/2023 11/7/2023 12/5/2023

CMOS LOGIC GP Superb (40G)

Tech(nm)
45
Process Flavor
CMOS LOGIC GP Superb (40G)
Block Size
9 mm2
Tape Out Date for 2H 2023
9/12/2023 11/7/2023

CMOS Embedded Memory Flash RF LP

Tech(nm)
55
Process Flavor
CMOS Embedded Memory Flash RF LP
Block Size
12 mm2
Tape Out Date for 2H 2023
10/18/2023

CMOS HV MX based LP LDMOS Triple Gate

Tech(nm)
65
Process Flavor
CMOS HV MX based LP LDMOS Triple Gate
Block Size
12 mm2
Tape Out Date for 2H 2023
8/9/2023 10/4/2023 12/6/2023

CMOS LOGIC GP Plus

Tech(nm)
65
Process Flavor
CMOS LOGIC GP Plus
Block Size
12 mm2
Tape Out Date for 2H 2023
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023

CMOS LOGIC ULP

Tech(nm)
65
Process Flavor
CMOS LOGIC ULP
Block Size
12 mm2
Tape Out Date for 2H 2023
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023

CMOS MX/RF GP Plus

Tech(nm)
65
Process Flavor
CMOS MX/RF GP Plus
Block Size
12 mm2
Tape Out Date for 2H 2023
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023

CMOS LOGIC LP

Tech(nm)
65
Process Flavor
CMOS LOGIC LP
Block Size
12 mm2
Tape Out Date for 2H 2023
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023

CMOS MX/RF LP

Tech(nm)
65
Process Flavor
CMOS MX/RF LP
Block Size
12 mm2
Tape Out Date for 2H 2023
7/5/2023 8/9/2023 9/13/2023 10/4/2023 11/8/2023 12/6/2023

CMOS Embedded Memory Flash MS based LP

Tech(nm)
90
Process Flavor
CMOS Embedded Memory Flash MS based LP
Block Size
16 mm2
Tape Out Date for 2H 2023
12/20/2023

CMOS Embedded Memory Flash RF LP

Tech(nm)
90
Process Flavor
CMOS Embedded Memory Flash RF LP
Block Size
16 mm2
Tape Out Date for 2H 2023
12/20/2023

CMOS HV MX based LP BCD Dual Gate

Tech(nm)
130
Process Flavor
CMOS HV MX based LP BCD Dual Gate
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS HV MXbased LP BCD Triple Gate

Tech(nm)
130
Process Flavor
CMOS HV MX based LP BCD Dual Gate
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS MX MS GP - 8 inch

Tech(nm)
130
Process Flavor
CMOS MX MS GP – 8 inch
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS MX MS LP - 8 inch

Tech(nm)
130
Process Flavor
CMOS MX MS LP – 8 inch
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS MX/RF GP - 8 inch

Tech(nm)
130
Process Flavor
CMOS MX/RF GP – 8 inch
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS HV MXbased LP BCD Triple Gate

Tech(nm)
130
Process Flavor
CMOS HV MXbased LP BCD Triple Gate
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS MX MS General Purpose

Tech(nm)
130
Process Flavor
CMOS MX MS General Purpose
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS MX MS LP

Tech(nm)
130
Process Flavor
CMOS MX MS LP
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS MX/RF GP

Tech(nm)
130
Process Flavor
CMOS MX/RF GP
Block Size
25 mm2
Tape Out Date for 2H 2023
8/2/2023 11/22/2023

CMOS HV MX based GP BCD Single Gate

Tech(nm)
180
Process Flavor
CMOS HV MX based GP BCD Single Gate
Block Size
25 mm2
Tape Out Date for 2H 2023

CMOS HV MX based General Purpose BCD Dual Gate

Tech(nm)
180
Process Flavor
CMOS HV MX based General Purpose BCD Dual Gate
Block Size
25 mm2
Tape Out Date for 2H 2023
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023

CMOS HV MX GP Gen-3 BCD Dual Gate

Tech(nm)
180
Process Flavor
CMOS HV MX GP Gen-3 BCD Dual Gate
Block Size
25 mm2
Tape Out Date for 2H 2023
9/13/2023 11/15/2023

CMOS Embedded Memory Flash MX based GP

Tech(nm)
180
Process Flavor
CMOS Embedded Memory Flash MX based GP
Block Size
25 mm2
Tape Out Date for 2H 2023
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023

CMOS HV MX based LDMOS

Tech(nm)
180
Process Flavor
CMOS HV MX based LDMOS
Block Size
25 mm2
Tape Out Date for 2H 2023
7/5/2023 8/16/2023 9/13/2023 10/18/2023 11/22/2023 12/13/2023

CMOS LOGIC GP

CMOS MX MS GP

CMOS MX/RF GP

CMOS HV MX GP IIA based BCD Dual Gate

CMOS HV MX GP IIA based BCD Single Gate

CMOS HV MX GP IIA based BCD Triple Gate

CMOS MX MS GP

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NOTE

Tech (nm)

Process Flavor

Block Size

Tape Out Date for 2H 2023

Tech
(nm)

Process
Flavor