Outsourced Semiconductor Manufacturing Operations (OSeMO)
Our Mission
Provide complete fabless semiconductor outsourced manufacturing solution from wafer to finished goods, from prototype to mass production with primary focus on high quality, supply availability and continuous improvement to customer’s bottom line
Wafer Fabrication
- Technology and Fab selection
- Full TO Support
IC Packaging
- Package & OSAT selection
- Package &Substrate Design
Product PLC
- PLC Planning & RTP
- Test & characterization Planning
Prototype Build
- Engineering Builds & Sampling
- System level testing.
Qualification
- Full Silicon Qualification per JEDEC
- Full Package Qualification per JEDEC
Test Development
- Test Vector conversion
- Test program development.
- ATE Board development
Planning & Logistics
- Wafer & Assembly build planning
- Logistics & Drop ship support
Product Sustaining
- CIP for cost/DDP reduction
- Yield & Margin improvement
Partnership with World-class Foundry
Partnership with Top tier OSAT vendors around the world
Reputed local test partners for test development and Failure analysis
ATE Test Development
Tester Platforms
- Advantest/Verigy 93K/Pin Scale and Smart Scale & Wave Scale testers for SoC products
- Advantest/Verify 93K Port Scale for RF products
- Eagle Teradyne for analog products
Test Differentiation
- Highly integrated SOCs
- Mixed Signal – ADC, DAC,
- RF Transceiver
- RF/5G
- High speed SerDes (up to 16 Gbps)
- PMUs
- Embedded Memory
- SLT production on customer products
Testing
Service
- Test Plan Generation Test Platform Selection
- Test HW development
- Test Vector conversion
- Test BI Qualification Program generation
- ES Test program generation
- Final Test program generation
- Qual Test program generation
Supply Chain Management
Shipping & Logistics:
- Shipping & Receiving enablement
- On-Time delivery
- POS and Consignment ware housing
Supply Planning:
- Wafer and Assembly build plans
- Capacity Planning
- Supply Planning & Scenario planning
Order Management:
- Customer Order management
- Drop ship enablement
- RMA management
Manufacturing:
- Assembly & Test release instructions
- Yield management
- Vendor Management
Quality, Reliability & Failure Analysis
Silicon Qualification
- ESD (HBM and CDM)
- Latch-Up (LU)
- Burn-In (HTOL)
Package Qualification
- MSL & Pre-Conditioning
- uHAST/HAST
- High-Temperature Storage(HTS)
- Temperature Cycling (TC)
- Board Level test (TC & Drop Test)
Failure Analysis
- Burn-in Board Design
- ESD Board Design
- Burn-In Vector conversion
- Pre and Post Qualification Testing
- Perform Shift Analysis
- Fit Rate Calculation
GSME – CIP
Continuous
Improvement
Process
Yield Enhancement
Process Optimization & Test Optimization
DPPM Reduction
Test coverage improvement& Ongoing Reliability Monitor
ATE Test
Test coverage optimization & Test time reduction
Cost Improvement
& Supply optimization
High Margins
Increase margins with Yield improvement, Test time reduction & Cost reductions
Why GSME?
World Class Manufacturing
Manufacturing team with proven track record and over 25 years experience
Resource Pool
Access to pool of resources as required and when required from package design to supply chain planning
Cost Efficiency
With collective demand from all our customers we achieve better pricing and capacity allocation
Partnership
Partnership with leading edge foundries, packaging and test OSAT’s around the world enabling faster and cost-effective solutions
Quality
Higher quality standards for manufacturing and constant monitoring of quality and reliability of the product
Engagement Options
Turnkey Service
End to end support from Fab selection, packaging to testing
Complete support in FA and Reliability services
No markup on any 3rd party services or tooling.
Quarterly flat fee for the services
Flexible cancellation policy
Project