We are thrilled to announce a momentous milestone in our pursuit of technological advancements. Our Oman-1 and Oman-2 chips have been submitted successfully to TSMC, marking the groundbreaking development of the first-ever chips designed entirely in Oman. This achievement celebrated during a chip tape out event, showcased our team's exceptional capabilities and unwavering commitment to innovation, establishing us as a predominant force in the semiconductor industry. We would like to express our sincere gratitude and appreciation to the esteemed representatives from the Oman Ministries who graced the occasion with their presence. His Excellency Eng. Said Hamoud Al Maawali, Minister of Transport, Communications and Information Technology, His Excellency Qais Mohammed Al Yousef, Minister of Commerce, Industry and Investment Promotion, His Excellency Dr. Ali Amer Al Shidhani Undersecretary of Communication and Information Technology at Ministry of Transport, Communication and Information Technology, and His Excellency Sayyid Salim Musallam Al Busaidi, Undersecretary of the Ministry of Labour for Human Resources Development. Their invaluable support, along with their deep understanding and vision for the technological landscape in Oman has been instrumental in fostering the strong collaboration between industry and the government. We extend our heartfelt appreciation to these distinguished individuals for honoring us with their presence and for their continuous support in driving technological advancements in the country.